i. 2D Materials
ii. III-Nitride materials and Devices
iii. Accelerating Printed Electronics R&D with AI-Driven Robotic Platforms
iv. Flexible and Stretchable Electronics
v. Heterogeneous integration and IC packaging
vi. Next-Generation SiC MOSFETs Powering the EV Revolution
vii. Quantum materials, heterostructures, and advanced characterizations
viii. Thermal Interfaces and Management of power electronics and integrated circuits
ix. Ultra Wide Bandgap Semiconductor Materials & Devices
x. Wide Bandgap Semiconductor Devices for Power Conversion and High-Frequency Applications