Infrastructure

The Center for Interface Sciences for Emerging Devices & Systems (CISEDS) is proud to have the Birck Nanotechnology Center in Purdue and The NC State Nanofabrication Facility as the home for many of our research projects. The Birck Nanotechnology Center is a 186,000 sq ft. facility with Class 1-10-100 and 1000 nano¬fabrication cleanroom, equipped with the latest technology to support ongoing research in the areas of nano electronics, photonics, energy, MEMS, nanobio technology and nano-manufacturing. The NC State Nanofabrication Facility also provides a wide range of nanofabrication capabilities to support a diverse set of projects, including standard thin film processing tools. Both facilities provide a melting pot for a community of top-notch researchers from academia, government labs and industry, representing a variety of disciplines. This allows CISEDS to conduct cutting-edge research in the areas of Flexible and Stretchable Electronics, Heterogeneous integration and IC packaging, Next-Generation SiC MOSFETs Powering the EV Revolution, Quantum materials, heterostructures, and advanced characterizations, Thermal Interfaces and Management of power electronics and integrated circuits, Ultra Wide Bandgap Semiconductor Devices for Power Conversion and High-Frequency Applications, Wide Bandgap Semiconductor Devices for Power Conversion and High-Frequency Applications.

Birck Nanotechnology
Center

Home to 300 resident students, faculty and staff
186,000 sq ft. Class 1-10-100-1000 nanofabrication cleanroom
Helping to develop a local high-tech ecosystem in collaboration with Discovery Park District

NCSU Nanofabrication Facility (NNF)

Broad range of nanofabrication capabilities
All standard thin film processing tools
Users from academia, government labs and industry

Research Triangle Nanotechnology Network (RTNN)

CISEDS members will also have access to the Research Triangle Nanotechnology Network (RTNN) as an innovation hub for semiconductors and nanotechnology research & commercialization. RTNN is a network of 3 universities: Duke, UNC, and NCSU, and also 9 core shared user facilities. These facilities provide top-of-the-line research-grade equipment that CISEDS PIs and members will have access to, allowing for even more advanced research and development in the field of semiconductors and nanotechnology.

RTNN INCLUDED NINE core shared user facilities

1) Analytical Instrumentation Facility

2) Chapel Hill Analytical and Nanofabrication Laboratory (CHANL)

3) Chemical Analysis and Spectroscopy Laboratory (CASL)

4) Duke Magnetic Resonance Spectroscopy Center (DMRSC)

5) NCSU Nanofabrication Lab (NNF)

6) Nuclear Reactor Program

7) Public Communication of Science & Technology Project (PCOST)

8) Shared Materials Instrumentation Facility (SMIF)

9) Zeis Textiles Extension for Economic Development (ZTE)

Our PIs at both sites are experienced with center activities and have all directed or been a PI in one or more centers in the past. For example, Vashaee and Ozturk at NCSU have worked in the ASSIST ERC, which focuses on flexible self-power wearable electronics. Veliadis at NCSU is the CTO of PowerAmerica, a DOE WBG power electronics manufacturing institute. Bhattacharya and Hopkins at NCSU are members of FREEDM ERC, which focuses on packaging, solid-state transformers, and power systems for advancing the US power grid. At Purdue, Chen is directing NEW LIMITS, an nCORE SRC center, focusing on new materials for logic, memory and interconnects beyond conventional CMOS. Shakouri at Purdue leads SMART Consortium, which partners with dozens of small and large manufacturers. Appenzeller at Purdue is directing CAPSL, another multi-university SRC center focusing on Probabilistic Spin Logic Devices based on stochastic nanomagnet-based hardware units. With access to these resources and the expertise of our PIs, CISEDS is well-equipped to conduct cutting-edge research in areas of interest to our members.

ASSIST ERC: Flexible, self-powered wearable devices, Daryoosh Vashaee & Mehmet Ozturk
PowerAmerica: Advancing WBG Power Electronics, Victor Veliadis
FREEDM ERC: Modernizing the US power grid, Subhashish Bhattacharya & Douglas C. Hopkins
NEW LIMITS: NEW materials for Logic, Memory, and InTerconnectS, Zhihong Chen
SMART Films consortium (Scalable Manufacturing of Aware & Responsive Thin Films), Ali Shakouri
CAPSL: Probabilistic Spin Logic for Low-Energy Boolean and Non-Boolean Computing, Joerg Appenzeller